Sunday, October 4, 2009

How to Lap Your CPU, Processor For a Cheap Cooling Performance Upgrade

"Lapping" A CPU includes removing the IHS (integrated heat sink) by the processor. Through the production of variants of the processor IHS is to slightly concave or convex. This leads to inconsistent contact with the heat sink, which decreased by a moderate margin of cooling.

If you are an enthusiast who likes to overclock, lapping processor is a very good idea. It is not only cooling the cheapest upgrade you can perform, it is also the most benefits when theValue for money. The additional cooling can even allow you to continue your processor, because of increased cooling to overclock.

In this guide, I lapped an Intel Q6600 G0. Before lapping, I could only to the processor to 3.2 GHz overclock maximum temperature under load of 70 C Core 0 and 69 ° C Core 1 Ideally, you should see the CPU temperature below 70 ° C hold After lapping, the maximum temperature under load dropped to 62 ° C and 57 ° C Core 0 Core 1, the maximumDecrease of 12 ° C - quite a big difference! Since the temperature had fallen so far, I was able to bump the CPU voltage even more and more overclocking the CPU to 3.4GHz.

Instructions

Lapping processor is very simple and requires little skill. All you need is about 600 and 1000 sandpaper, usually found at your local auto parts or ACE hardware store.

IMPORTANT: Be sure to discharge static electricity beforeany contact with computer components, especially the CPU. Static electricity can cause permanent damage computer parts. To discharge themselves by touching a metal object, such as your PC case or use an antistatic wrist strap grounding.


First remove the CPU from your system. Clean all the thermal paste from the processor. I like to use it isopropanol and Q-Tips.
Then you should protect the underside of the processor from dust and dirt. To keep things simple, you can simply a piece ofpaper cut into the shape of the processor. Tape the piece of paper to the underside of the processor using electrical or masking tape. In the picture I used a cotton cleaning cloth, but paper is more abundant and will work just fine.
Lay the 600 grit sandpaper across a completely flat surface. A wood table would not be the best surface to use because of the pits and valleys in the wood itself. Instead, use a mirror or glass table top.
Turn the processor upside down and start sanding off the integrated heat sink with a back and forth movement. Do not sand in a circular motion, since this is causing the surface of the heat sink the same everywhere. After about 10-20 swipes back and forth across the sandpaper, then turn 90 degrees and sand the processor an additional 10-20 times.
Repeat this process until you almost completely from the built-in heat sink (as in the image displayed on the website).
Once you reach this point, turn off your grit sandpaper to 1000 and using the same grinding process to remove the restthe IHS.
They are ready when the IHS is completely gone and nothing is more exposed than copper. At this point, the lapping process.

If you prefer, you can use higher sandpaper, such as 2000 K to end the copper on the CPU to an almost mirror look. However, this step is completely uneccessary and there is no performance gain, it is only for cosmetic purposes. The left picture shows the CPU after it has been overtaken with 1000 sandpaper (excuse theDust)

Install your CPU and apply thermal paste as normal. If you wish, you can also use your lap heat sink following the same procedure. This will probably not help, cooling as much as lapping your CPU, but it will probably still be a gain.



No comments:

Post a Comment